澳洲10官方计划

Here at ICTC USA, our Original Equipment and Manufacturing (OEM) services deliver the technology, expertise, quality and personal dedication our customers deserve.

Printed Circuit Card Assembly:

  • Rigid & rigid-flexible PCBs
  • Low – Medium volume Surface Mount Technology (SMT), Through-hole & Mixed Technology production in USA
  • Medium – High volume SMT, Through-hole & Mixed Technology production in the Philippines
  • uBGA, CSP, QFN, NVME BGA (0.4mm)
  • Typical sizes, thicknesses & lawyer to include FR4, PTFE (Teflon), Al clad and Flex substrates
  • X-Ray technology 
  • Flying Probe
  • Inline AOI
  • 3D SPI
  • Device package sizes from 01/005 to 2 inches square
  • Operators certified to J- STD-001 and IPC-A-610, up to Class III
  • Additive Manufacturing (3D Printing)
  • RoHS Compliant
  • Conformal Coat Capabilities

At ICTC USA, we earn your trust by putting your needs first. Whether your needs are for a domestic solution, or a solution off-shore, you can be confident that an ICTC USA solution will bring your products to market like no other electronics manufacturer.